We provide customers with high-quality PCB assembly design and assembly services, from small batches of complex customized products to large batches of standard products, and also meet customer requirements for quantity and complexity.We give priority to meeting the customer’s delivery time while ensuring quality and minimizing total cost.Our engineers can develop and design boards according to customer requirements, and will carry out manufacturing design (DFM), test design (DFT) and cost control.Producing high quality products by using the latest software technology and then perform PCBA project management, design, documentation and production.

Process Technology
Ball Grid Array (BGA) Technology、Chip On Board (COB)、Tape Automated Bonding (TAB)、Bare Chip Welding Wire、Personal Computer Memory Card International Association (PCMCIA) and Selective Soldering can meet various volume, mixing, and complexity requirements, precision welding process, odd shaped parts mounting and other hybrid technologies.

Process Technology
01005 and 0201 chip components, Metal Electrode Leadless Face (MELF), DIP insertion, lead forming for components.Assembly and production of FR4, aluminum, flexible printed circuit board.PCBA Housing assembly, including firmware loading and full function testing, RF function, embedding, protective coating.

Inspection Technology
X-Ray, Automatic Optical Inspection (AOI), Functional Circuit Test (FCT), SPI.